Get a better product enclosure fit with true 3D component shapes
20 September 2015
Zuken helps product designers meet the challenges of small and complex enclosures, with 3D clearance analysis using true component shapes.
True 3D checks of multi-board designs can be carried out against all aspects of a product, including the enclosure. This latest version of Zuken’s CR-8000 single and multi-board design software also includes improved accuracy in layer configuration design work through transfer of layer configuration data between CR-8000 Design Force and Polar Instruments Speedstack.
As manufacturers push to fit boards in ever-smaller spaces, enclosures become more complex and achieving a good product fit gets harder. It is estimated that up to 50 percent of prototypes need to be reworked at the manufacturing stage because of a fit problem creating significant project risk in terms of cost and time for product designers.
To help meet this challenge, CR-8000 Design Force now allows users to perform even more accurate 3D checks by using a true 3D component model with a precisely-matched 3D shape, rather than simply using a shape defined by a boundary box.
Accurate shape parts can be used for collision checks and 3D clearance checks. This ability to check the enclosure early and continuously in the design process supports better collaboration between the electrical and mechanical design teams, eliminating the silo effect and reducing time to market and design iterations.
Layer configuration data can now be transferred between CR-8000 Design Force and Polar Instruments Speedstack, bringing the manufacturing and PCB design stages closer together. This ensures that the most accurate and up-to-date information from material manufacturers and PCB manufacturers is being used, removing the need to re-input stackup data thus saving time and improving quality.
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