Ansys releases V12.0 of electronics thermal management simulation software

06 July 2009

Ansys has released Version 12.0 of its electronics system design thermal management simulation software, Icepak. Based on the company's Fluent CFD solver, Icepak brings greater automation and flexibility for meshing complex electronics geometry. Two new meshing technologies — automatic multi-level meshing and Cartesian hex-dominant meshing — significantly enhance the software’s ability to handle complex geometries and improve accuracy without sacrificing robustness.

New meshing enhancements provide improved mesh smoothness, quality, curvature and proximity capturing, and speed. The automatic generation of highly accurate, conformal meshes that represent the true shape of electronic components and the solution of fluid flow and all modes of heat transfer for both steady-state and transient thermal flow simulations.