This website uses cookies primarily for visitor analytics. Certain pages will ask you to fill in contact details to receive additional information. On these pages you have the option of having the site log your details for future visits. Indicating you want the site to remember your details will place a cookie on your device. To view our full cookie policy, please click here. You can also view it at any time by going to our Contact Us page.

Improve Your Vinyl Extrusion Throughput By Up To 25%

01 August 2004





Teknor Apex is claiming between 15 and 25% improvements in extrusion
throughput with its new flexible vinyl profile compounds, thanks to their
lower processing temperatures. As cooler material is more viscous, it can
pass through sizing equipment at higher speeds without compromising
dimensional integrity. The new compounds are particularly suitable for
the production of complex or thick-walled profiles that are difficult to
keep within tolerance when extruded 'hot'. The compounds are available in
clear, lightly filled and moderately filled formulations.
















Contact Details and Archive...

Print this page | E-mail this page