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Improve Your Vinyl Extrusion Throughput By Up To 25%

01 August 2004

Teknor Apex is claiming between 15 and 25% improvements in extrusion
throughput with its new flexible vinyl profile compounds, thanks to their
lower processing temperatures. As cooler material is more viscous, it can
pass through sizing equipment at higher speeds without compromising
dimensional integrity. The new compounds are particularly suitable for
the production of complex or thick-walled profiles that are difficult to
keep within tolerance when extruded 'hot'. The compounds are available in
clear, lightly filled and moderately filled formulations.

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