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Analog Devices collaborates with Intel on radio platform to address 5G network design challenges

Analog Devices, Inc. (ADI) & Intel Corporation will create a flexible radio platform that enables customers to scale up their 5G networks more quickly and economically.

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IN-BOX transparent-lid enclosures now in PC and available in 16 sizes

OKW has further expanded its range of IN-BOX industrial electronic enclosures. The transparent-lid version is now available in polycarbonate (PC) for extra strength and flammability resistance.

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A new dimension for sensor technology

The binder Innovation & Technology Centre (ITZ) has developed a new direct printing technique that allows the application of functional electronic layers directly on a component.

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New MapleMBSE release from Maplesoft expands support to include Capella

MapleMBSE 2020.2 offers expanded toolchain connectivity, improved performance and usability.

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