This website uses cookies primarily for visitor analytics. Certain pages will ask you to fill in contact details to receive additional information. On these pages you have the option of having the site log your details for future visits. Indicating you want the site to remember your details will place a cookie on your device. To view our full cookie policy, please click here. You can also view it at any time by going to our Contact Us page.

Flexible and low viscosity potting compound

07 February 2008

Master Bond has introduced a flexible, tough epoxy potting and encapsulation compound called EP30FL. It has extraordinarily low viscosity, is easy to apply, and can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low.

Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates. Because of its flexibility, it is particularly recommended for use in environments exposed to thermal cycling. Additionally, it can withstand mechanical shock and vibration. The hardened compound has superior electrical insulation properties and resistance to water.

Master Bond EP30FL is available in ½ pint, pint, quart, gallon and 5 gallon pail kits.

Contact Details and Archive...

Print this page | E-mail this page