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Epoxy adhesive serviceable at cryogenic temperatures

02 May 2008

Master Bond has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (ie. room temperature down to liquid helium temperatures in a 5-10 minute time period).

Master Bond EP29LPSP has a mix ratio of 100 to 65 by weight. It cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6-8 hours. EP29LPSP features superior physical strength properties and excellent chemical resistance. It bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. When curing, EP29LPSP has a low exotherm.

EP29LPSP has a low viscosity and is easy to apply. Its mixed viscosity is 400 cps. It has a tensile strength of 6,500 psi and a tensile modulus of >375,000 psi. When cured, EP29LPSP is a superior electrical insulator. Its volume resistivity is >1015 ohm-cm and its dielectric constant is 3.6. It has a Shore D hardness of 80.

Master Bond EP29LPSP is optically clear. It is available for use in pint, quart, gallon and 5 gallon kits. It is also available in syringe applicators.


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