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Ensinger introduces the TECASINT product line

18 May 2009

Plastics processor Ensinger has extended its program within the area of amorphous, infusible high-temperature polyimides. The new product line, TECASINT, includes several new developments and modifications, as well as proven materials which have been established in the market under the brand name SINTIMID. The company introduces semi-finished products and direct formed parts made of the new material TECASINT 2000 which is characterized, amongst other things, by improved toughness. The polyimide portfolio is to be further developed this year.

Semi-finished products and direct formed parts made of TECASINT have outstanding long-term thermal stability. The broad temperature range of these materials extends from -270°C to 300°C. TECASINT materials will even withstand short-term heating to 350°C, without melting or softening. Material strength, dimensional stability and creep resistance under mechanical load also remain high in continuous use.

The sintering material, TECASINT 1000, was introduced twenty years ago to the market under the name SINTIMID. The newly developed products from ENSINGER include the high-temperature polyimides in the TECASINT 2000 series. These rigid and hard materials exhibit a high Young’s modulus and improved thermal stability and sliding friction characteristics compared to TECASINT 1000. A further advantage of the new development is the clearly reduced moisture absorption, which permits narrow construction tolerances to be achieved. In addition, the material can be machined with high precision thanks to its high degree of toughness.

TECASINT 2000 is eminently suitable for the direct forming procedure, which allows economical volume production of parts, for example, in the automotive industry and mechanical engineering. Ensinger offers the new product in different tribologically optimized variations for use in sliding friction applications.

The basic monomers, TECASINT 1000 and 2000, can be categorized in the “high purity” class which is important for wafer production, i.e. they are characterized by outgassing and a particularly low level of ionic impurities. These characteristics are also a prerequisite for their use in space-related or high vacuum applications.

TECASINT 5000 (previously: SINTIMID PAI) is a non-thermoplastic processible high-temperature polyamide-imide. The sintering material is particularly suitable for applications in semiconductor manufacturing. TECASINT 5000 is available as the pure material, glass-fibre reinforced or in different electrostatic dissipating variations, which can achieve surface resistances from 1012 to below 103 Ω.

Products in the TECASINT 8000 series (SINTIMID 8000) are proven materials for sliding friction applications. The base material PTFE is reinforced by PI powder in proportions of 7% to 40%. TECASINT 8000, which is available as semi-finished products (plates, rods) and as sliced film sheeting, is suitable for soft counterparts such as aluminium, brass or bronze.

Compared to non-reinforced PTFE, TECASINT 8000 excels through decreased creep under load and a higher abrasion resistance. The material is already successfully being used with lip seals, sliding strips for textile and packaging machines as well as for bearings and sliding elements under higher loads.

Semi-finished materials from the TECASINT 1000, 2000, 5000 and 8000 ranges are available from stock as plates and rods in different dimensions. In addition, ENSINGER also supplies short tubes made of the materials TECASINT 1000, 2000 and 8000 up to a length of 180 mm with a maximum outside diameter of 120 mm.


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