Low pressure overmoulding with hotmelt polyamide
03 April 2012
Techsil has introduced Macromelt to the UK, a low pressure overmoulding hotmelt polyamide range from Henkel. Henkel provides an extensive range of thermoplastic hotmelt polyamide materials to meet a variety of specific requirements, such as cable and strain relief, encapsulation of small pcbs, sensors, switches, terminals, antennas and so on.
Techsil has introduced Macromelt to the UK, a low pressure overmoulding hotmelt polyamide range from Henkel. Henkel provides an extensive range of thermoplastic hotmelt polyamide materials to meet a variety of specific requirements, such as cable and strain relief, encapsulation of small pcbs, sensors, switches, terminals, antennas and so on.
The main benefits at-a-glance:
- Low pressure - typically 4bar
- Short cycle time - usually 15 seconds cure time
- Uses less adhesive per application
- Low temperature for fragile component
- Water and chemical resistant
- UL94 V-0 rated
- Operating temperature -40°C to 140°C
- Adhesion to PA, PBT, PVC and similar
- Aluminium mould tooling
A short video clip is available here.
Download the Macromelt brochure here.
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