This website uses cookies primarily for visitor analytics. Certain pages will ask you to fill in contact details to receive additional information. On these pages you have the option of having the site log your details for future visits. Indicating you want the site to remember your details will place a cookie on your device. To view our full cookie policy, please click here. You can also view it at any time by going to our Contact Us page.

Ultra-conforming gap filler is easy to dispense

15 May 2012

The Bergquist Company's latest dispensable thermal material, Gap Filler 1000SR, has high slump resistance to maintain shape and height after dispensing. The new formula is a soft elastomer for filling intricate air voids inside enclosures or within fragile assemblies, or between any heat-generating semiconductor and a heatsink.

Gap Filler 1000SR has optimal characteristics for dispensing, and flows easily under minimal pressure. This ultra-conforming behaviour, combined with high softness after curing, prevents stress on components during assembly and in normal operation. A low level of natural tack allows use in applications where a strong structural bond is not required.
When cured, Gap Filler 1000SR has thermal conductivity of 1W/mK which maximises heat transfer thereby promoting cooling and enhancing system reliability. It has demonstrated consistent thermal performance and voltage breakdown throughout tests including 85ºC/85% relative humidity, high-temperature continuous bake and thermal cycling.

The material is available in cartridges from 50cc to 400cc, or in kits of 1200cc or 10 gallons, and is suitable for manual or automated dispensing. Pot life is rated at 60 minutes, and the cure time is 20 minutes at room temperature or 10 minutes at 100°C.

Contact Details and Archive...

Print this page | E-mail this page