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Electrically conductive adhesives are nickel free

18 May 2013

New from Intertronics is the Polytec EC 275 range of conductive adhesives in a low cost, two component formulation for applications in electronics, micro-electronics, opto-electronics, hybrids and sensor technology.

Polytec EC 275 can be used for IC packaging, connecting circuits to copper coils (RFIDs or smart cards) and EMI/RF shielding. The paste-like adhesive can be easily applied with various dispensing techniques or screen printing and is available either as two components or premixed and frozen in syringes.

Polytec EC 275 utilises nickel free fillers not based on silver flake to create an electrically conductive performance appropriate for die attach, SMD bonding, RFID antennas, and EMI/RFI shielding applications.

The product is therefore less expensive than conventional silver loaded adhesives, which are subject to volatile precious metal markets, but still offers comparable electrical performance.

Polytec EC 275 is easy to process due to convenience packaging, and it has a pot life of 

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