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Ultra-slim, fanless SBC is optimised for IoT applications

11 January 2015

BVM Group has introduced the ASRock UTX-110, a super-compact SBC in the new 4.4in x 4.6in UTX form factor, developed in response to requirements for powerful embedded computing required for the growth of the Internet of Things (IoT).

The UTX-110 is based on the Bay Trail fourth generation Intel Atom E3800 single/dual/quad core SoC family; it supports up to 8GB of single channel DDR3L 1333MHz DRAM. With dual display 1920 x 1200 HDMI capability and dual channel 24-bit 1920 x 1200 LVDS, it offers high-resolution graphics and enhanced stereoscopic 3D.

The ultra-slim profile allows installation in confined spaces, and its reliability meets intelligent embedded systems’ requirements for maintenance-free extended MTBF. The UTX-110 is designed for intelligent systems and other applications where low power consumption, high performance and fanless operation are essential.

Two Gigabit Ethernet ports, one USB3.0 and two USB2.0 ports and two serial ports are provided. Full and half size Mini-PCIe slots and an expansion slot support Wi-Fi via an external module and give additional mass storage via mSATA.

A separate internal SATA 3Gb/s port is also provided. To maximise heat dissipation, the processor is mounted on the solder side of the board. Power is from an external 12VDC source and AT/ATX operation is supported.


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